• The manufacturer's datasheet on the device is obtained and evaluated by an engineer.
• A specific device test quote is established.
• Specific test routines are then written by the engineer based on the device's key functional aspects.
• Following the development of the device test application, the engineer then migrates these tests and hardware layouts to our mixed signal test platforms. From this point, high volume device testing can be completed.

• We have custom internally designed hardware integrated with our test systems that are usable for testing virtually all devices.
• Significantly reduced NRE/development fees per device.
• Verifies die presence.
• Verifies continuity from leads to bond pads.
• Verifies overall device health by evaluating current pull during nominal power-up and operation.
• Confirms a subset of device functionality as determined by our engineers.
• Turn time is amongst the quickest in the industry, often within 4 - 7 business days of receiving parts for sample lot size testing, including high pin count QFPs and BGA packages.

Counterfeiting is all too common in the industry, ranging from the remarking of various devices to match the desired device, to selling defective 'correct' units as working units. Our testing is geared to identify these units and prevent them from entering or continuing through the supply chain. A variety of key functional parameters are developed and implemented by our engineers per manufacturer specifications to verify both authenticity and functionality of devices.

All material received is processed through our Q/A incoming department. Units are evaluated per IDEA-STD-1010A standards including: device marking validation, surface examination under magnification (evaluating for evidence of remarking, blacktopping, sanding, etc), verification of leads (evaluating for bent/used leads/balls, oxidation, etc), verification of device dimensions, physical counts and digital imaging of all material.

Decapsulation is a destructive die verification process that involves exposing the internal die of a part or component. This process allows us to microscopically reveal the internal part number and logos supplied by the original component manufacturer. These markings can then be compared to the external markings for clear and conclusive authentication.

Many devices have multiple potential ratings, whether it be temperature (Commercial, Industrial, Space, etc) or rated speed. Due to availability constraints, users may procure material at a lower rating and have it tested at the more demanding rating their end application requires (for example, utilizing Commercial rated parts where the typical requirement may be Industrial rated parts). Our team has the ability and resources to test material to the 'up-screened' requirements and document the results for customer records.

Upon request, we are able to test units per MIL-STD-883, Group 'A' testing parameters. This is often required by end users of material going into mission critical applications (i.e., military applications, medical devices, etc). Our team has the hardware and the ability to meet these stringent requirements.