Whether your product is tube based or tray, we utilize the best vision systems available to inspect your product, then tape it to your exact specifications. Capabilities include: Tray to Tape, Tube to Tray, 3D Laser Scanning, 2D/3D Vision System, In-Line Mark Inspection, Laser Mark, and Multiple Device Package Support.

Reliability and extended life spans of Electronic Components are affected by 'tin whiskers' that can equate to component failure over time. To reduce and minimize the impact of these 'tin whiskers', we recommend performing our hot solder dip process on the leads. Using a tin-lead solder and reflowing the entire leads, we are able to repair afflicted devices and reduce future impacts of tin whiskers.

All parts are baked according to your required MSL (Moisture Sensitivity Level) per JEDEC Standards. Moisture sensitivity for semiconductor devices are classified based on end product re-flow sensitivity. Parts are classified into eight categories numbered as: MSL-1, MSL-2, 2a, 3, 4, 5, 5a, and 6, with 6 being the most sensitive to moisture. Humidity Indicator cards for quality environmental packaging, High volume dry pack bag sealers - offering air tight clean seals, Vacuum and soft seal capability, Bake and exposure times clearly recorded for quality purposes, and Customized exposure warning labels.

Simulating usage of a device for an extended period of time, burn in allows us to verify device functionality over a simulated period of time. With this we are able to verify present device operation and help ensure longevity of the devices.